F23P - 3U Compact PCI Plus IO Intel Core i7 4th Gen

F23P - 3U Compact PCI Plus IO Intel Core i7 4th Gen

Intel® Core™、4th Generation搭載

3U CompactPCI Plus IOボード

0〜60℃まで動作温度保証

動作温度拡張版あり -20~60℃(On Request)

Celeron® 2002Eの場合、-40〜85℃動作温度保証

Linux、Windows、VxWorksをサポート

F23P Specification
CPU - Intel® Core™ i7
- Intel® Core™ i5
- Intel® Core™ i3
- Intel® Celeron
Memory ・System memory
-Soldered DDR3, ECC support
-4 GB, 8 GB, or 16 GB
・Boot Flash
-16MB
Mass Storage • The following mass storage devices can be assembled:
- microSD™ card
- mSATA disk
IF ■Front
• Video
- One VGA connector
- Additional interfaces are available via a side card
- The front channel can optionally be led to the backplane
• USB
- Two Series A connectors, USB 2.0 (480 Mbit/s)
• Ethernet
- Two RJ45 connectors, 1000BASE-T (1 Gbit/s), or
- One RJ45 connector, 1000BASE-T (1 Gbit/s), or
- One 9-pin D-Sub connector, two 100BASE-T (100 Mbit/s), or
- Two M12 connectors on 8 HP, two 1000BASE-T (1000 Mbit/s)
- One front channel can optionally be led to the backplane
- Two link and activity LEDs per channel
• Front-panel LED for board status
• Reset button
■Rear
• Compatible with PICMG 2.30 CompactPCI® PlusIO
- 1PCI33/4PCIE5/4SATA6/4USB2/1ETH1G, or
- 1PCI33/4PCIE5/4SATA6/4USB2/2ETH1G
• SATA
- Four channels, SATA Revision 3.x (6 Gbit/s), RAID level 0/1/5/10 support
• USB
- Four channels, USB 2.0 (480 Mbit/s)
• Ethernet
- One channel, 1000BASE-T (1 Gbit/s), or
- Two channels, 1000BASE-T (1 Gbit/s)
- One front channel can optionally be led to the backplane
• PCI Express
- Four x1 links (500 MB/s per link), PCIe® 2.x (5 Gbit/s per lane)
Environmental Specifications • Temperature range (operation)
- -40°C to +85°C (model 02F023P00)
- 0°C to +60°C (model 02F023P01)
- Airflow 1.5 m/s
- Depends on system configuration (CPU, hard disk, heat sink...)
• Temperature range (storage): -40°C to +85°C
• Cooling concept
- Air-cooled
- Conduction-cooled in MEN CCA frame
• Relative humidity (operation): max. 95% non-condensing
• Relative humidity (storage): max. 95% non-condensing
• Altitude: -300 m to +2000 m
• Shock: 50 m/s², 30 ms
• Vibration (Function): 1 m/s², 5 Hz to 150 Hz
• Vibration (Lifetime): 7.9 m/s², 5 Hz to 150 Hz
EMC • EN 55022 (radio disturbance)
• IEC 61000-4-2 (ESD)
• IEC 61000-4-3 (electromagnetic field immunity)
• IEC 61000-4-4 (burst)
• IEC 61000-4-5 (surge)
• IEC 61000-4-6 (conducted disturbances)
BIOS InsydeH2O™ UEFI Framework
Software Support • Note that 64-bit hardware technology can be used in an optimal way with 64-bit
operating system support
• Windows
• Linux
• VxWorks®

お問い合わせ

インテリジェントシステムソリューション本部

TEL:045-474-9015